LasePro is dedicated to providing customers with high-reliability, high-quality, and highly efficient semiconductor packaging modules. Our product range spans various wavelengths, including 808nm-1064 nm, and power levels ranging from milliwatts to several hundred watts. Our product quality and reliability have earned recognition from customers both domestically and internationally. These modules find application in a wide range of industries, including machining, printing, power generation, telecommunications, lighting, material processing, monitoring, and scientific research.
Furthermore, we offer comprehensive solutions and high-quality products for customization, utilizing advanced semiconductor die-bonding packaging technology, beam shaping technology, fiber coupling technology, and mature, optimized manufacturing processes. This includes chip bonding, aging tests, beam shaping, fiber coupling, and the entire product design, catering to the unique requirements of our diverse customer base.
| Wavelength | Power | Fiber | Application |
| 915nm, 940nm, 975nm | 10-700W | 0.15/0.22NA; 105/200μm | Pumping |
| 808 nm | 1-320W | 0.22NA; 105/200/400μm | Pumping |
| 808nm, 976nm,1064nm | 1-740W | 0.22NA; 105/200/400μm | Medical |
| 830nm | 1W, 2W | 0.14NA/0.22NA; 50/62.5um | CTP Printing |
| 830nm | 1W, 2W | 0.22NA 62.5μm | Power and Communication |
| 9XXnm | 10-30W | 0.22NA 105μm | Power and Communication |